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    true

    裝配、雙面和無基材膠帶

    裝配、雙面和無基材膠帶?

    有機硅壓敏粘合劑?

    如今的電子設備要求制造商在眾多因素中平衡成本和性能,從粘合強度和電氣性能到基材和加工參數。?陶氏提供創新的有機硅壓敏粘合劑 (PSA),可為各種電子應用和環境優化性能。我們的有機硅PSA具有有機粘合劑無法匹敵的關鍵優勢。

    用于電子裝配膠帶的PSA

    對于需要粘接、臨時固定或可移動RFID標簽的電子裝配膠帶應用,陶氏的PSA產品提供:

    • 出色的一致性?
    • 耐高溫性?
    • 耐化學性?
    • 清潔可移動性?
    • 低遷移率?
    • 與PE、PI和PTFE背襯兼容?

    用于無基材膠帶和標簽的PSA?

    對于無基材膠帶和標簽應用,如表面改性、遮蔽膠帶、零件粘合、汽車/電氣標簽或特種標簽,陶氏的PSA解決方案提供:

    • 寬廣的工作溫度范圍?
    • 防潮/防紫外線?
    • 對低能量表面的附著力?
    • 易于剝離性?
    • 與各種氟硅氧烷涂層的防粘襯里背襯兼容

    快速鏈接

    查找合適的解決方案(英語)
    通過我們的有機硅PSA指南了解更多信息

    查看指南
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